Memory devices having source lines directly coupled to body regions and methods

ABSTRACT

Memory devices, memory cell strings and methods of operating memory devices are shown. Configurations described include directly coupling an elongated body region to a source line. Configurations and methods shown should provide a reliable bias to a body region for memory operations such as erasing.

PRIORITY APPLICATION

This application is a divisional of U.S. application Ser. No.14/299,813, filed Jun. 9, 2014, which is a divisional of U.S.application Ser. No. 13/011,223, filed Jan. 21, 2011, now issued as U.S.Pat. No. 8,750,040, all of which are incorporated herein by reference intheir entirety.

BACKGROUND

Higher memory density is always in demand to provide smaller deviceswith higher memory capacity. Forming memory devices laterally on asurface of a semiconductor chip uses a great deal of chip real estate.Improved memory devices are needed with new configurations to furtherincrease memory density beyond traditional laterally formed memorydevices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a memory device according to an embodiment of theinvention.

FIG. 1A shows a cross section along line 1A-1A from FIG. 1 according toan embodiment of the invention.

FIG. 1B shows a cross section along line 1B-1B from FIG. 1 according toan embodiment of the invention.

FIG. 2A shows a memory device during an erase operation according to anembodiment of the invention.

FIG. 2B shows a block diagram of a portion of the memory device fromFIG. 2A during an erase operation according to an embodiment of theinvention.

FIG. 3 shows a memory device during a program operation according to anembodiment of the invention.

FIG. 4 shows a memory device during a read operation according to anembodiment of the invention.

FIG. 5 shows selected stages of forming a memory device according to anembodiment of the invention.

FIG. 6 shows an information handling system using a memory deviceaccording to an embodiment of the invention.

DETAILED DESCRIPTION

In the following detailed description of the invention, reference ismade to the accompanying drawings that form a part hereof and in whichare shown, by way of illustration, specific embodiments in which theinvention may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theinvention. Other embodiments may be utilized and logical, electricalchanges, etc. may be made.

The term “horizontal” as used in this application is defined as a planeparallel to the conventional plane or surface of a substrate, such as awafer or die, regardless of the orientation of the substrate. The term“vertical” refers to a direction perpendicular to the horizontal asdefined above. Prepositions, such as “on”, “side” (as in “sidewall”),“higher”, “lower”, “over” and “under” are defined with respect to theconventional plane or surface being on the top surface of the substrate,regardless of the orientation of the substrate. The following detaileddescription is, therefore, not to be taken in a limiting sense, and thescope of the present invention is defined only by the appended claims,along with the full scope of equivalents to which such claims areentitled.

FIGS. 1, 1A, and 1B show a memory device 100 formed on a substrate 102.A charge storage layer(s) 112 (e.g., a combination of a tunneldielectric layer, a polysilicon layer, and a charge blocking layer; acombination of a nitride layer, an oxide layer, and a nitride layer; orother any other layer or combination of layers that can provide a chargestorage function, whether currently known or future developed),substantially surrounds an elongated body region 110 to form arespective charge structure corresponding to each of a plurality ofgates 114 (which may also substantially surround respective crosssections of the elongated body region 110 and charge storage layer(s)112). A first select gate 120 and a second select gate 122 are shown toselectively couple the elongated body region 110 to drain region 132 anda source region 130, respectively. A dielectric 104 can fill in spacesbetween components such as those described above.

FIG. 1A shows an embodiment where the elongated body region 110 forms a“U” shape with a pair of upward facing ends 111, 113. Another exampleconfiguration (not shown) includes a linear, vertical, elongated bodyregion 110 with one end facing upward, and the other end facingdownward. Another example configuration (not shown) includes ahorizontal, linear, elongated body region 110 with ends on either side.Embodiments with two upward facing ends, 111, 113, such as the “U”shaped configuration, can enable easier formation of some components atthe ends 111, 113 of the elongated body region 110 during manufacture,compared to embodiments where components are formed deeper in thestructure.

In one example, the elongated body region 110 is formed from a p typesemiconductor material, such as p-type polysilicon. The elongated bodyregion 110 can be formed in multiple process steps, such as where afirst end 111 is formed in a different polysilicon deposition step thanthat used to form other portions of the elongated body region 110, suchas second end 113. Accordingly, in at least some embodiments, first end111 may be higher than second end 113. A source region 130 and a drainregion 132 are shown coupled to the first end 111 and the second end 113of the elongated body region 110, respectively. In one example, thesource region 130 and the drain region include n type semiconductormaterial, such as n+ polysilicon. In operation, the pathway of sourceregion 130, to elongated body region 110, to drain region 132 acts as ann-p-n transistor, with select gates 120, 122, and gates 114 operating toallow, or inhibit signal transmission along the way.

A source line 126 and a data line, such as bitline 128, are showncoupled to the source region 130 and the drain region 132 respectively.In one embodiment, a plug 124 is used to directly couple (e.g., directlyphysically connect to form an electrical connection, or otherwise forman electrical connection without a potential for a n-p or p-n junctionbreakdown) the bitline 128 to the drain region 132. Each of the sourceline 126, bitline 128 and plug 124 can comprise, consist of, or consistessentially of metal, such as aluminum, copper, or tungsten, or alloysof these or other conductor metals. In the present disclosure, the term“metal” further includes metal nitrides, or other materials that operateprimarily as conductors.

As noted above, FIG. 1 shows the drain region 132 directly coupled tothe plug 124, which effectively couples the drain region 132 to thebitline 128. The source region 130 is shown directly coupled to thesource line 126. The elongated body region 110 is also directly coupledto the source line 126.

The cross section along line 1B-1B shows the select gates 120 and 122.As can be seen in the cross section, in one embodiment, the select gates120 and 122 are substantially continuous along a row. In thisconfiguration, actuation of a select gate 120 or 122 actuates aplurality of elongated body regions at a time.

The cross section shown along line 1A-1A shows a number of drain regions132 and a source region 130. As can be seen in the cross section, in oneembodiment, the drain regions 132 are separate, while the source region130 is substantially continuous, with a single source region 130 usedfor a plurality of elongated body regions 110. In one example the sourceregion 130 substantially surrounds a cross section of a first end 111 ofeach of a plurality of elongated body regions 110.

By directly coupling the elongated body region 110 to the source line126, the elongated body region 110 has the ability to be biased, andoperate less as a floating body element. Biasing of the elongated bodyregion 110 via a direct coupling can provide reliable memory operationssuch as an erase operation in particular.

An example erase operation, according to an embodiment of the invention,is illustrated with respect to FIGS. 2A and 2B. A memory device 200,similar to embodiments described above, is shown with an example memorycell string 202 circled in the figures. According to one such eraseoperation embodiment, with the bitline 228 and select gates 220, 222 ofstring 202 floating, the source line 226, and thus the elongated bodyregion 210 of the string 202, is biased to an erase voltage (e.g.,approximately 20 volts), and the gates 214 of the string 202 are biasedto a selected voltage (e.g., approximately 0 volts). Given the providedexample biasing voltages, the select gates 220, 222 of string 202 arethus coupled up to approximately 15 volts, while the bit line 228 (andplug 124) is coupled up to approximately 20 volts. The potentialdifference between the body region 110 and gates 214 (e.g., 20 volts tozero volts) is used to erase stored charge from the charge storagestructure adjacent to each individual gate 214 in the memory cell string202.

Because the elongated body region 210 is directly coupled to the sourceline 226, the elongated body region 210 is biased when a bias is appliedto the source line 226. Direct coupling between the elongated bodyregion 210 and the source line 226 provides a charge pathway between theelongated body region 210 and the source line 226 that avoids junctionbreakdown between an n-type region and a p type region.

In FIG. 2B, the direct coupling of the elongated body region 210 to thesource line 226 can be seen at a first end 211 of the elongated bodyregion 210. In contrast, a second end 213 of the elongated body region.210 is indirectly coupled to the bitline 228 through the drain region232.

FIG. 3 shows a memory device 200 undergoing an example program operationaccording to an embodiment of the invention. The memory device 200 fromprevious Figures is used as an example. As in FIG. 2A, an example memorycell string 202 is circled.

With FIG. 3 as a reference, the bitline 228, source line 226 and sourceselect gate 222 are biased to respective program enable voltages (e.g.,approximately zero volts each). A selected gate 314 is biased with aprogram voltage (e.g., approximately 20 volts), while the drain selectgate 220 of the selected string 202 is biased to, e.g., approximately 2volts. The potential difference between the selected gate 314 and thebody region of the selected string 202 (e.g., 20 volts to zero volts) isused to transfer charge to the charge storage structure adjacent to theselected gate 314 in the selected memory cell string 202. To avoidprogramming a memory cell corresponding to selected gate 314 in theadjacent, unselected string, the drain select gate of that string can bebiased to, for example, approximately zero volts. Unselected gates 214are biased with an inhibit voltage (e.g., approximately 10 volts) tocouple up the body region of the unselected string to an inhibitvoltage.

FIG. 4 shows a memory device 200 undergoing an example read operationaccording to an embodiment of the invention. The memory device 200 fromprevious Figures is used as an example. As in previous Figures, anexample memory cell string 202 circled.

With FIG. 4 as a reference, the bit line 228 is biased to, for example,approximately 0.5 volts, and the source line 226 is biased to, forexample, approximately zero volts. A selected gate 314 is biased with aread voltage (e.g., between approximately 0 volts and approximately 4volts, such as depending upon what program state is being read), whilethe drain select gate 220 of the selected string 202 is biased to, e.g.,approximately 2 volts. Unselected gates 214 are biased to a pass voltage(e.g., approximately 6 volts) to permit a signal to pass along theelongated body region of the selected string. If gate 314 is erased,then the signal will pass through the elongated body region of theselected string and be detected. To avoid reading a memory cellcorresponding to selected gate 314 in an adjacent, unselected string,the drain select gate of that string can be biased to, for example,approximately zero volts.

FIG. 5 illustrates an example process flow to form selected portions ofa memory device according to an embodiment of the invention. Inparticular, the example process flow of FIG. 5 illustrates one method ofdirectly coupling an elongated body region to a sourceline. Operation510 illustrates a planarization and etch stop operation. In oneembodiment, an etch stop layer 512 is a silicon nitride (SiN) layer.Operation 520 illustrates a dielectric layer 522 deposition andpatterning step. A number of openings 524 are shown formed in thedielectric layer 522 by etching or other suitable process. Operation 530illustrates formation of source regions and drain regions by filling inthe number of openings 524 with an n doped semiconductor. In oneembodiment, the number of openings 524 are filled with an n+ polysiliconmaterial

Operation 540 illustrates formation of a second number of openings 542within the filled portion that will become source regions. In operation550, the second number of openings 542 are filled to form an extensionof the elongated body regions. In one example, the second number ofopenings 542 are filled with the same material as the elongated bodyregion. In one example, the second number of openings 542 are filledwith p+ polysilicon. Operation 560 illustrates a routing layerformation. Sourcelines 562, plugs 564 and bitlines 566 may be formed aspart of the routing layer formation.

An embodiment of an information handling system such as a computer isincluded in FIG. 6 to show an embodiment of a high-level deviceapplication for the present invention. FIG. 6 is a block diagram of aninformation handling system 600 incorporating a memory device accordingto embodiments of the invention as described above. Information handlingsystem 600 is merely one embodiment of an electronic system in whichdecoupling systems of the present invention can be used. Other examplesinclude, but are not limited to, tablet computers, cameras, personaldata assistants (PDAs), cellular telephones, MP3 players, aircraft,satellites, military vehicles, etc.

In this example, information handling system 600 comprises a dataprocessing system that includes a system bus 602 to couple the variouscomponents of the system. System bus 602 provides communications linksamong the various components of the information handling system 600 andmay be implemented as a single bus, as a combination of busses, or inany other suitable manner.

Chip assembly 604 is coupled to the system bus 602. Chip assembly 604may include any circuit or operably compatible combination of circuits.In one embodiment, chip assembly 604 includes a processor 606 that canbe of any type. As used herein, “processor” means any type ofcomputational circuit such as, but not limited to, a microprocessor, amicrocontroller, a graphics processor, a digital signal processor (DSP),or any other type of processor or processing circuit.

In one embodiment, a memory device 607 is included in the chip assembly604. In one embodiment, the memory device 607 includes a NAND memorydevice according to embodiments described above.

In one embodiment, additional logic chips 608 other than processor chipsare included in the chip assembly 604. An example of a logic chip 608other than a processor includes an analog to digital converter. Othercircuits on logic chips 608 such as custom circuits, anapplication-specific integrated circuit (ASIC), etc. are also includedin one embodiment of the invention.

Information handling system 600 may also include an external memory 611,which in turn can include one or more memory elements suitable to theparticular application, such as one or more hard drives 612, and/or oneor more drives that handle removable media 613 such as compact disks(CDs), flash drives, digital video disks (DVDs), and the like. Asemiconductor memory die constructed as described in examples above isincluded in the information handling system 600.

Information handling system 600 may also include a display device 609such as a monitor, additional peripheral components 610, such asspeakers, etc. and a keyboard and/or controller 614, which can include amouse, trackball, game controller, voice-recognition device, or anyother device that permits a system user to input information into andreceive information from the information handling system 600.

While a number of embodiments of the invention are described, the abovelists are not intended to be exhaustive. Although specific embodimentshave been illustrated and described herein, it will be appreciated bythose of ordinary skill in the art that any arrangement that iscalculated to achieve the same purpose may be substituted for thespecific embodiment shown. This application is intended to cover anyadaptations or variations of the present invention. It is to beunderstood that the above description is intended to be illustrative andnot restrictive. Combinations of the above embodiments, and otherembodiments, will be apparent to those of skill in the art upon studyingthe above description.

What is claimed is:
 1. A memory device, comprising: a data line; asource; a first string of memory cells coupled at a first end to thedata line by a first select gate, and directly coupled at a second endto the source through a second select gate; a second string of memorycells coupled at a first end to the data line by a third select gate,and directly coupled at a second end to the source through a fourthselect gate; and a controller, wherein the controller is configured toconcurrently bias the data line and the source to substantially the samepotential, and perform a program operation on a selected memory cell ofthe first string of memory cells.
 2. The memory device of claim 1,wherein the controller is further configured to bias the first selectgate to a potential greater than the potential to which it concurrentlybiases the data line.
 3. The memory device of claim 1, wherein the firstand the second strings of memory cells are vertically formed above asubstrate.
 4. A memory device, comprising: a plurality of strings ofmemory cells, where each string of memory cells is coupled at a firstend to a data line and where each string of memory cells is directlycoupled at a second end to a source; and a controller, wherein thecontroller is configured to concurrently bias the data line and thesource to a substantially same potential and to perform a programoperation on a selected memory cell of a selected string of memory cellswhile the data line and the source are biased to substantially the samepotential.
 5. The memory device of claim 4, wherein the plurality ofstrings of memory cells comprise vertically formed strings of memorycells.
 6. A memory device, comprising: a plurality of strings of memorycells, where each string of memory cells is coupled at a first end to adata line and where each string of memory cells is directly coupled at asecond end to a source; and a controller, wherein the controller isconfigured to concurrently float the data line, bias the source to anerase potential, and perform an erase operation on the memory cells ofthe plurality of strings of memory cells.
 7. The memory device of claim6, wherein the controller is further configured to bias a control gateof each memory cell of the plurality of strings of memory cells to apotential less than the erase potential to which the source is biasedduring the erase operation.
 8. The memory device of claim 6, wherein thepotential to which the control gates of the memory cells are biasedcomprises a ground potential.
 9. An electronic system, comprising: acommunications interface; a memory access device coupled to thecommunications interface and configured to generate memory devicecommands; and a memory device coupled to the communications interfaceand configured to be responsive to the memory device commands, thememory device comprising: a data line; a source; a first string ofmemory cells coupled at a first end to the data line by a first selectgate, and directly coupled at a second end to the source through asecond select gate; a second string of memory cells coupled at a firstend to the data line by a third select gate, and directly coupled at asecond end to the source through a fourth select gate; and a controller,wherein the controller is configured to concurrently bias the data lineand the source to substantially a same potential, and perform a programoperation on a selected memory cell of the first string of memory cells.10. The electronic system of claim 9, wherein t S ring and the secondstring comprise vertically formed strings of memory cells.
 11. A memorydevice, comprising: an elongated body region, having a source regioncoupled to a first d and a drain region coupled to a second end; aplurality of gates along a length of the elongated body region, each ofthe plurality f gates being separated from the elongated body region byat least a charge storage structure; and a source line directly coupledto the body region, wherein the source region surrounds a cross sectionof the first end of the elongated body region and is also coupled to thesource line.
 12. The memory device of claim 11, wherein the elongatedbody region oriented vertically.
 13. The memory device of claim 11,wherein the elongated body region is oriented horizontally.
 14. Thememory device of claim 11, wherein the elongated body region forms a “U”shape.
 15. The memory device of claim 11, further including acontroller, wherein the controller is configured to concurrently biasthe data line and the source to substantially the same potential, andperform a program operation on a selected memory cell of the firststring of memory cell.
 16. The memory device of claim 11, furtherincluding a controller, wherein the controller is configured toconcurrently bias the data line and the source to a substantially samepotential and to perform a program operation on a selected memory cellof a selected string of memory cells while the data line and the sourceare biased to substantially the same potential.
 17. The memory device ofclaim 11, further including a controller, wherein the controller isconfigured to concurrently float the data line, bias the source to anerase potential, and perform an erase operation on the memory cells ofthe plurality of strings of memory cells.